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NTD85N02R
Power MOSFET
24 Volts, 85 Amps
Single N?Channel,
DPAK/IPAK
Features
http://onsemi.com
? Planar HD3e Process for Fast Switching Performance
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Low Gate Charge to Minimize Switching Losses
? Pb?Free Packages are Available
Applications
? CPU Power Delivery
? DC?DC Converters
? Low Side Switching
V (BR)DSS
24 V
R DS(ON) MAX
5.2 m W @ 10 V
N?Channel
D
I D MAX
85 A
G
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Drain?to?Source Voltage
Gate?to?Source Voltage
Symbol
V DSS
V GS
Value
24
± 20
Unit
V
V
S
4
Continuous Drain
Current R q JA
(Note 1)
T A = 25 ° C
T A = 85 ° C
I D
17
12
A
4
Power Dissipation
R q JA (Note 1)
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
P D
I D
P D
2.4
12
8.8
1.25
W
A
W
1 2
3
DPAK
CASE 369AA
STYLE2
1
2
3
DPAK?3
CASE 369D
STYLE 2
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
I D
P D
85
58
78.1
A
W
MARKING DIAGRAM
& PIN ASSIGNMENTS
4
Pulsed Drain T A = 25 ° C, t p = 10 m s
Current
Current Limited by Package T A = 25 ° C
Operating Junction and Storage
I DM
I DmaxPkg
T J ,
192
45
?55 to
A
A
° C
1
3
2
YWW
85
N02G
4
1 Gate
2 Drain
3 Source
4 Drain
Temperature
T STG
+150
Source Current (Body Diode)
Drain to Source dV/dt
I S
dV/dt
78
6
A
V/ns
Y
WW
85N02R
= Year
= Work Week
= Specific Device Code
1
2
3
Single Pulse Drain?to?Source Avalanche
Energy T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 13 A pk , L = 1.0 mH, R G = 25 W)
EAS
85
mJ
G
= Pb?Free Package
ORDERING INFORMATION
Lead Temperature for Soldering Purposes
T L
260
° C
See detailed ordering and shipping information in the package
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface?mounted on FR4 board using 1 sq?in pad, 1 oz Cu.
2. Surface?mounted on FR4 board using the minimum recommended pad size.
dimensions section on page 3 of this data sheet.
? Semiconductor Components Industries, LLC, 2007
January, 2007 ? Rev. 9
1
Publication Order Number:
NTD85N02R/D
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